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Contract manufacturing

Contract manufacturing
Item description:
A full range of contract electronics manufacturing services (EMS, OEM). Services of design and manufacture of custom (ODM). The modern production line enables us to provide services for SMT, THT assembly, component assembly, manufacturing of plastic enclosures.
The scalability and flexibility of production
Adapting to our R & D hardware and software under the modern element base and technology
Quality control and service. Systems: PS-Tracebility, PS-Vision. The quality management system of the plant corresponds to ISO 9001-2015
Minimum PCB size 60х60 mm
Maximum PCB size 500х460 mm
Types of surface mount components components of rectangular and cylindrical components SO, PLCC, QFP, TSOP, BGA, μBGA, CSP and other surface mounted device irregular shape
The minimum amount of components 0,5х0,25 mm (0201)
Maximum height of components 25 mm
Minimum Spacing 0,3 mm
The accuracy of component placemen 35 mkm for QFP and 60 mkm for chips
Additional information on this product
Maximum performance of the assembly line of 184,000 components per hour (for IPC). Factory production capacity of up to 1 200 000 subscriber units a year.

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